Dual Plane Technique Silicone Gel Augmentation
Posted On: July 24, 2012 Author: The Office of Dr. Stuart Linder Posted In: Home
In the majority of all breast augmentation surgeries we perform weekly in our Beverly Hills ambulatory facility, breast implants, either silicone or saline, are placed using the dual plane technique (two-thirds subpectoral and the lateral third subglandular). The anatomy of the lateral pectoralis major muscle extending from the head of the humerus down to the ribcage can be found in an oblique manner canting superolaterally. As a result, when the implants are placed subpectoral or submuscular, actually the medial two-thirds of the implant are under the muscle with the outer third subglandular without muscle coverage.
The patient presents with bilateral breast dysphoria, involutional upper pole atrophy and loss of upper pole fullness. She desired to be a nice C-size breast with a natural shape. Style 20, 320 cc smooth silicone gel implants, Allergan Natrelle cohesive gel implants were placed using the dual plane technique with a very small incision made through the periareolar approach. Notice her postoperative results at six weeks show excellent cleavage with symmetric inframammary folds and well-healed scarring around the nipple areolar complex. The upper pole of the breast shows a natural slope without undue rounding. Even though style 20 high profile gel implants were used, by using the dual plane technique, two-thirds under and one-third over laterally, we were able to achieve a nice upper natural slope with good fullness, especially with an underwire brassiere. The dual plane technique is considered by myself as the gold standard of the standard of choice when performing breast augmentation surgery. It allows for excellent coverage of the implants, reduces visibility and rippling of the implant, as well as allows enhanced detection of malignancy, calcifications or breast cancers by mammography with radiology when patients will require screening and diagnostic mammograms in the future.